Precision Injection Molded Encapsulation: Your 2026 Solution for Durable, High-Performance Protection

We offer a comprehensive range of materials for injection molded encapsulation products:

• Liquid Silicone Rubber (LSR):
  • Standard grades (30-70 Shore A)
  • High thermal conductivity (1.5-3.0 W/m·K)
  • Medical grade (USP Class VI, ISO 10993)
  • Flame retardant (UL94 V-0)
  • Optically clear for LED applications
• High Consistency Rubber (HCR):
  • 80-90 Shore A for rigid protection
  • Low compression set for long-term sealing
• Thermoplastics:
  • Polyurethane (PU): Excellent chemical resistance
  • Polyamide (PA): High temperature resistance
  • Polypropylene (PP): Cost-effective for consumer goods

Selection Guide:

• Medical devices: LSR Class VI or medical-grade polyurethane
• Automotive sensors: High thermal conductivity LSR or flame-retardant PU
• Consumer electronics: Standard LSR (40-50 Shore A) or soft-touch TPE
• Industrial equipment: Chemical-resistant PU or high-durometer HCR
• Optical applications: Clear LSR with high light transmittance

Our engineers will analyze your requirements (temperature range, chemical exposure, mechanical stress, regulatory needs) to recommend the optimal material. We can also develop custom formulations to meet your specific performance needs.

Our MOQ depends on the complexity of your project:

• Standard projects: 5,000-10,000 pieces (for existing mold designs)
• Custom tooling projects: 20,000-50,000 pieces (to amortize mold costs)
• Prototyping: 10-100 pieces (using soft tooling or 3D printed molds)
• High-volume production: 100,000+ pieces with dedicated tooling

Mold Cost Considerations:

• Simple single-cavity mold: $3,000-$8,000
• Complex multi-cavity mold: $15,000-$50,000+
• Prototype tooling: $1,000-$5,000 (for validation)

We offer shared tooling programs for startups and small businesses. Contact us to discuss how we can make your project economically viable regardless of volume.

Note: For injection molded encapsulation products, the economics improve dramatically with volume due to the high precision and speed of the process compared to manual methods.

Our injection molded encapsulation products achieve superior protection through:

1. Material Selection:

• Low viscosity LSR: Flows easily around complex geometries to eliminate voids
• High adhesion promoters: Chemically bonds to substrates (PCB, metals, plastics)
• Low shrinkage: <0.5% to prevent stress cracks

2. Process Control:

• Vacuum assistance: Removes air bubbles before injection (reference: Springer Vacuum Molding Study)
• Precise pressure control: Ensures complete cavity fill without flash
• Optimal curing: Full cross-linking for maximum environmental resistance

3. Design Features:

• Sealing lips: For interfaces between materials
• Venting channels: In mold design to prevent air entrapment
• Uniform wall thickness: Prevents stress concentrations

4. Testing and Validation:

• IP68 Testing: 2m depth for 24 hours (IEC 60529)
• Salt spray test: 96-500 hours (ASTM B117)
• Thermal shock: -40°C to 125°C, 1000 cycles
• Pressure test: Up to 10 bar for deep-sea applications
• Dielectric test: Up to 5kV AC for 1 minute

Our defect rate for encapsulation integrity is <0.05%, far exceeding industry standards.

Our lead times are among the fastest in the industry for injection molded encapsulation products:

• Prototyping:
  • 3D printed prototypes: 3-5 days
  • Soft tooling samples: 7-10 days
• Production Tooling:
  • Simple single-cavity molds: 15-20 days
  • Complex multi-cavity molds: 25-35 days
  • Fast-track option: 10-15 days (with expedited fees)
• Production:
  • First articles: 3-5 days after tooling completion
  • Mass production: 7-14 days after approval

Expedited Services Available:

• 24/7 production: For urgent orders (additional 30-50% cost)
• Air freight: 3-5 day delivery to USA/Europe
• Local inventory: We maintain stock of common materials for faster turnaround

Our Dongguan location provides strategic advantages:

• Proximity to major component suppliers
• Direct access to Shenzhen port (2-hour drive)
• Established logistics partnerships for global shipping

Note: For 2026 production slots, we recommend placing orders 6-8 weeks in advance to secure capacity, especially for complex projects.

Our comprehensive quality control system for injection molded encapsulation products includes:

1. Incoming Material Inspection:

• Certificate of Analysis (COA): Verify material properties match specifications
• Rheological testing: Confirm viscosity and curing characteristics
• Batch testing: Each lot is tested for hardness, tensile strength, and elongation

2. In-Process Controls:

• Automated monitoring: 200+ parameters tracked in real-time
• First article inspection: 100% measurement of first 50 pieces
• Statistical process control (SPC): CpK >1.33 for all critical dimensions
• Visual inspection: Automated optical systems check for defects

3. Final Product Testing:

• Dimensional inspection: CMM (Coordinate Measuring Machine) for complex geometries
• Cross-section analysis: Verify encapsulation thickness and void-free filling
• Functional testing: As per your specifications (electrical, thermal, mechanical)
• Environmental testing: Temperature cycling, humidity, vibration

4. Packaging and Shipping Inspection:

• ESD protection: For sensitive electronics
• Moisture barrier: Vacuum sealing for long-term storage
• Label verification: Part numbers, quantities, and batch codes

Certifications:

• ISO 9001:2015 Quality Management
• ISO 13485 Medical Devices
• IATF 16949 Automotive
• ISO 14001 Environmental Management

Our defect rate is consistently below 50 ppm (0.005%), with most projects achieving 10-20 ppm.

Absolutely! Our injection molded encapsulation process is ideal for protecting pre-assembled components. We specialize in:

1. Insert Molding:

• PCB encapsulation: Direct encapsulation of populated circuit boards
• Connector overmolding: Sealing around existing connectors or terminals
• Multi-component assemblies: Encapsulating sensors, batteries, and other components together

2. Design Considerations for Pre-Assembled Components:

• Component orientation: We optimize the position to prevent damage from injection pressure
• Venting: Critical for preventing air entrapment around sensitive components
• Material flow: Designed to avoid displacing or damaging existing components
• Thermal management: Consideration for heat-sensitive parts during curing

3. Specialized Techniques:

• Low-pressure injection: For delicate components (as low as 5 bar)
• Multi-shot molding: Different materials for different protection needs in one part
• Partial encapsulation: Leaving specific areas (like connectors) exposed
• Conformal coating first: For extremely sensitive components, we can apply a thin protective layer before full encapsulation

4. Success Stories:

• Medical implant: Encapsulated PCB with 0402 components and delicate wire bonds - 0% failure rate in 5-year field study
• Automotive sensor: Pre-assembled MEMS sensor and ASIC encapsulated in one shot - passed 1,000 thermal shock cycles
• Industrial IoT device: Full PCB with RF antenna encapsulated while maintaining signal integrity

Important Note: For best results with pre-assembled components:

• Provide complete component specifications (height, sensitivity, etc.)
• Share your assembly process so we can design around it
• Consider test points - we can design the encapsulation to leave these accessible